C. Coupeau1*, J. Durinck1 and G. Parry2

Thin films and coatings are used in a wide range of technological applications, such as microelectronics, packaging or optics. They often develop high residual stresses during the deposition process, sometimes about few GPa in compression. Such large compressive stresses may cause the nucleation and growth of buckling structures that generally result in the loss of functional properties that were initially conferred to such film/substrate composites. The aim of our studies is consequently to have a better understanding of the buckling phenomenon, by identifying the relevant parameters to prevent, to limit, or to control its occurrence.

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